DARPA Eyes Creation of Next-Generation Semiconductor Manufacturing Hub

The Defense Advanced Research Projects Agency (DARPA) has disclosed plans to award a contract next summer for the establishment of a U.S. hub dedicated to advanced microelectronics manufacturing. Termed the Next-Generation Microelectronics Manufacturing (NGMM) program, it aims to financially support research and acquire equipment for the development of a domestic center specializing in prototyping cutting-edge fabrication techniques. DARPA envisions this initiative as a catalyst to propel the U.S. semiconductor industry to the forefront, with the objective of having the capability operational by 2029.

The primary focus of this center will be on 3D heterogeneously integrated microsystems (3DHI), an innovative approach to microelectronics fabrication. The underlying principle of 3DHI research is to enhance performance by reconfiguring the integration and packaging of chip components, allowing for the efficient separation of functions like memory and processing.

This technological endeavor holds the potential to not only revolutionize the U.S. industrial base but has also piqued the interest of other nations, particularly Taiwan, a global leader in microelectronics production.

Highlighting the current gap in the U.S., DARPA emphasized the lack of an open-access manufacturing center with comprehensive capacity for 3DHI research and development. Anticipating that the next major wave of microelectronics innovation will involve integrating heterogeneous materials, devices, and circuits through advanced packaging, DARPA proposal seeks to establish a national accelerator dedicated specifically to next-generation 3DHI.

In a significant move in July, DARPA selected 11 teams to initiate foundational work for the center. The agency now plans to choose a single team for the next two phases of the NGMM program, with awards for each phase potentially reaching up to $420 million. The selected team, operating under an other transaction agreement, is expected to contribute funding for a portion of the work. DARPA intends to brief the industry on this effort on November 28.

The initiative gains significance against the backdrop of the U.S. relying heavily on Taiwan and China for the export of advanced semiconductors, leading to concerns about over-reliance on foreign supply chains for critical microsystems.

DARPA focus on forward-looking technologies, exemplified by NGMM, distinguishes its efforts from the broader U.S. government initiative, the CHIPS Act, which primarily aims to strengthen the domestic semiconductor industrial base in the short term. While the CHIPS Act focuses on immediate supply chain issues, DARPA endeavors in this domain are oriented toward preparing for "the next wave of innovation."

NGMM is a cornerstone of DARPA Electronics Resurgence Initiative 2.0, designed to address technological challenges impacting U.S. national security and commercial industry. The program initial phase will concentrate on acquiring equipment, establishing foundational fabrication processes, and developing automation and simulation software tailored to 3DHI systems. Phase 2 will involve creating hardware prototypes, automating processes, and developing emulation capabilities.

The ultimate goal of the NGMM program is to establish a self-sustaining 3DHI manufacturing center at an existing facility owned and operated by a non-federal entity. This facility would be accessible to users in academia, government, and industry. DARPA emphasizes success in terms of supporting the design, fabrication, assembly, and testing of a wide range of high-performance 3DHI microsystems at a reasonable cost with cycle times conducive to fast-paced innovative research.